Shanghai Huitian New Material Co., Ltd
Created with Pixso.
बोली
Created with Pixso. घर > उत्पादों >
इलेक्ट्रॉनिक चिपकने वाला
>

5280 1:1 Gray Silicone Potting Compound for Electronics with High Thermal Conductivity

5280 1:1 Gray Silicone Potting Compound for Electronics with High Thermal Conductivity

5280 1:1 Gray Silicone Potting Compound for Electronics with High Thermal Conductivity

उत्पाद विवरण:
उत्पत्ति के प्लेस: चीन
ब्रांड नाम: HUITIAN
प्रमाणन: RoHS REACH
मॉडल संख्या: 5280
विस्तार से जानकारी
उत्पत्ति के प्लेस:
चीन
ब्रांड नाम:
HUITIAN
प्रमाणन:
RoHS REACH
मॉडल संख्या:
5280
भौतिक रूप:
पेस्ट करें
रंग भाग ए:
भूरे रंग का तरल पदार्थ
रंग भाग बी:
सफ़ेद तरल पदार्थ
श्यानता भाग ए:
2,000 ~ 3,500 एमपीए · एस
चिपचिपाहट भाग बी:
2,000 ~ 3,500 एमपीए · एस
मिश्रण अनुपात:
1: 1
खुलने का समय @25 डिग्री सेल्सियस:
60-240 मिनट
इलाज का समय @80°C:
≤30 मिनट
कठोरता:
10 ~ 30 किनारे ए
मात्रा प्रतिरोधकता:
1.0*10^12 Ω∙सेमी
ढांकता हुआ ताकत:
≥14 केवी/मिमी
ऊष्मीय चालकता:
≥0.6 डब्ल्यू/(एम • के)
प्रमुखता देना:
gray silicone potting compound , high thermal conductivity potting compound , electronics silicone potting compound
ट्रेडिंग जानकारी
न्यूनतम आदेश मात्रा:
200 किलोग्राम
मूल्य:
बातचीत योग्य
पैकेजिंग विवरण:
20 किग्रा/बैरल
प्रसव के समय:
5-8 दिन
भुगतान शर्तें:
एल/सी, टी/टी
आपूर्ति की क्षमता:
2000t/महीना
उत्पाद वर्णन
5280 Two-Part 1:1 Gray Silicone Potting Compound For Electronics
High-performance potting compound designed for module power supply, LED drive power supply, network transformer, reversing radar, and other electronic applications. Provides moistureproof, anti-corrosion, and shock-proof protection.
Product Attributes
Attribute Value
Physical Form Paste
Color Part A Gray fluid
Color Part B White fluid
Viscosity Part A 2,000~3,500 mPa·s
Viscosity Part B 2,000~3,500 mPa·s
Mixing Ratio 1:1
Operating Time @25 °C 60-240 mins
Curing Time @80℃ ≤30 mins
Hardness 10~30 Shore A
Volume resistivity 1.0*10^12 Ω∙cm
Dielectric strength ≥14 KV/mm
Thermal Conductivity ≥0.6 W/(m•K)
Product Description
5280 Potting Compound is a high-performance, two-part addition-type silicone rubber designed specifically for the electronics industry. This gray, high thermal conductive compound offers exceptional insulation properties, flame retardancy, and mechanical stability over a wide temperature range. It is ideal for protecting sensitive electronic components from environmental hazards while ensuring long-term reliability and performance.
Download Technical Data Sheet (PDF)
Product Applications
  • Module Power Supplies: Provides moistureproofing and insulation to protect against short circuits and corrosion.
  • LED Drive Power Supplies: Ensures thermal management and mechanical stability, prolonging the lifespan of LED components.
  • Network Transformers: Offers excellent insulation and anti-fouling properties to maintain signal integrity.
  • Reversing Radars: Protects sensitive radar components from moisture and physical shock, ensuring reliable operation.
  • General Electronics: Suitable for a wide range of electronic components, providing comprehensive protection against moisture, dust, corrosion, and mechanical shock.
Key Product Features
  • High Thermal Conductivity: With a thermal conductivity of ≥0.6 W/m*K, the compound efficiently dissipates heat, ensuring optimal performance of electronic components.
  • UL94V-0 Flame Retardant: Meets stringent safety standards, providing excellent fire resistance and reducing the risk of electrical fires.
  • Excellent Insulation: Features a dielectric strength of ≥14 KV/mm, ensuring reliable electrical insulation and preventing short circuits.
  • Wide Temperature Range: Maintains rubber elasticity from -50°C to 200°C, ensuring consistent performance in extreme conditions.
  • RoHS Compliant: Environmentally friendly and compliant with the Restriction of Hazardous Substances Directive.
  • Ease of Use: 1:1 mix ratio simplifies the application process, ensuring consistent performance and reducing the risk of errors.
Technical Parameters
Physical Properties Before Curing (25 ±2℃, 60%±5%RH)
Appearance (A) Gray flow
Appearance (B) White flow
Viscosity (A) 2,000~3,500 mPa*s
Viscosity (B) 2,000~3,500 mPa*s
Curing Properties (A:B=1:1)
Operating Time (25℃) 60~240 min
Curing Time (85℃) ≤30 min
Physical Properties After Curing (25 ±2℃, 60±5%RH, A:B=1:1)
Density 1.70~1.9 g/cm³
Hardness 10~30 Shore A
Shear Strength (PCB) 0.3-0.8 MPa
Thermal Conductivity ≥0.6 W/m*K
Dielectric Strength ≥14 KV/mm
Volume Resistivity ≥1.0*10¹² Ω*cm
Directions for Use
Preparation
  • Stirring: Fully stir part A and part B separately, either manually or mechanically, to ensure homogeneity and avoid performance changes due to filler settlement.
Mixing
  • Weighing: Accurately weigh the two parts into a clean container by weight ratio (1:1) and stir well to ensure thorough mixing.
Defoaming
  • Natural Defoaming: Allow 20-30 minutes for natural defoaming after filling the mixed glue into the components.
  • Vacuum Defoaming: For faster defoaming, pot the components after pumping for 5-10 minutes at a vacuum degree of 0.08-0.1 MPa.
Potting
  • Surface Preparation: Ensure the surfaces to be potted are clean and dry. Apply the glue while it still has good flowability to achieve optimal leveling.
Curing
  • Curing Conditions: The glue can cure at room temperature or by heating. Higher temperatures accelerate curing, and heat curing is recommended in colder conditions (e.g., winter).
Packaging & Storage Conditions
Packaging
  • 5280CA9 (20 kg/barrel), 5280CB9 (20 kg/barrel)
Storage
Store at room temperature in a cool and dry place. The shelf life is 6 months.
5280 1:1 Gray Silicone Potting Compound for Electronics with High Thermal Conductivity 0 5280 1:1 Gray Silicone Potting Compound for Electronics with High Thermal Conductivity 1 5280 1:1 Gray Silicone Potting Compound for Electronics with High Thermal Conductivity 2

टैग:

Created with Pixso.
डाउनलोड करना Created with Pixso.